Feb 28, 2005
Design trade-offs for multimedia SoC in VDSM technologies
Accent at OCP-IP Partner Pavillion DATE '05
The Open Core Protocol International Partnership (OCP-IP) will feature a conference-within-conference program at the Design Automation and Test Expo (DATE) held 7-11 March 2005 in Munich Germany. The Pavilion will host exhibits from several OCP-IP member companies including Sonics, CAST, and MIPS and an open discussion forum in the midst of Europe’s largest electronic system design exhibition. The pavilion program will combine expert panel sessions and papers, offering visitors a view into key technical trends and insight into the SoC market of the future.
Papers and panels will encompass the diverse issues surrounding re-usable IP, such as: IP development, purchasing, interconnect, verification and testing, IP quality, network on chip (NOC) and more.
Presentations will be given by many OCP-IP member companies including: Accent, CoWare, First Silicon Solutions, MIPS, Nokia, Prosilog, Texas Instruments, TransEDA, Yogitech, and more. Panels will include: “Network on a Chip: Great idea, but where are the implementations?” “ IP from silicon vendors: Good or bad?” “New Paradigm for Design Excellence: What's on the Horizon?” moderated by Gary Smith, and “What is EDA Missing?” hosted by Ulf Schlictmann, University of Munich.
Source: OCP-IP
